PCB Embedded Component Technology 2026 — PatSnap Eureka
PCB Embedded Component Technology: Patent Landscape & Emerging Trends
Active and passive components embedded within PCB laminate layers are reshaping miniaturization, power integrity, and AI packaging. This landscape analyzes innovation signals from 2005–2026 patent filings across CN, KR, JP, US, and other jurisdictions.
Three Interconnected Domains Define PCB Embedded Component Technology
PCB embedded component technology — wherein active and passive electronic components are integrated within the laminate layers of a printed circuit board rather than mounted on its surface — spans three interconnected technical domains: the embedding of passive components (resistors, capacitors) and active components (ICs, power chips) within insulating layers of multilayer PCBs; the use of bridge-embedded substrates and high-density interconnect (HDI) structures to route signals between embedded elements; and additive manufacturing (AM) techniques that allow direct inkjet printing of PCBs with integrated chip cavities.
Core mechanisms identified across the dataset include cavity formation and chip insertion, via-based interconnection using interstitial via holes (IVH), thermal management integration with embedded heat-radiating metal planes, bridge embedding for ultra-short routing between co-packaged chips, and additive manufacturing of conductive and dielectric inks. Sub-domains include embedded passive substrates (EPS), embedded active component boards, rigid-flex PCBs with embedded optoelectronics, power-module-embedded boards, and AM-fabricated HDI circuits. For a full view of the patent landscape analytics behind this data, PatSnap's platform provides deep competitive intelligence across all these sub-domains.
The field is transitioning from foundational chip-cavity embedding toward AI compute packaging, power electronics integration, and AM-fabricated boards — a shift clearly visible in the 2023–2026 filing cohort.
Four Distinct Innovation Clusters in the PCB Embedded Dataset
Patent activity from 2006–2025 maps to four well-defined technical approaches, each with distinct assignees, application targets, and maturity levels.
Passive & Active Component Embedding in Multilayer PCB
The most well-established cluster in the dataset, with filings spanning 2006–2025. The core mechanism involves placing pre-tested chips or passive components into cavities within a core laminate, covering with prepreg or resin, and forming via connections to outer wiring layers. Key differentiators include dual-sided component stacking, variable-depth cavities matched to component thickness, and metal-core substrates (Al, Cu, stainless steel) for thermal and mechanical performance. Samsung Electro-Mechanics has filed at least 8 distinct patents in this cluster across CN, KR, JP, and US.
Samsung Electro-Mechanics · 2006–2025 · CN, KR, JP, USBridge-Embedded PCB for High-Density Interconnect (HDI)
Targets advanced packaging for AI accelerators and HBM memory systems. A die-level silicon or organic bridge is embedded within the PCB dielectric to provide short, high-bandwidth interconnects between ICs placed on the PCB surface above. The bridge is accessed via vias that penetrate both the bridge and surrounding insulating layers. Samsung Electro-Mechanics filed bridge-embedded PCB patents in US (2023) and JP (2024), explicitly targeting AI and high-bandwidth memory computing contexts — an adaptation of the EMIB concept to PCB-substrate form factors.
Samsung Electro-Mechanics · 2023–2024 · US, JPAdditive Manufacturing (AM) of Chip-Embedded PCBs
Nano Dimension Technologies has filed across multiple jurisdictions for inkjet-based AM methods that print conductive and dielectric inks to form PCB structures with dedicated chip cavities. The process uses robotic arms for chip placement and encapsulating overprints for interconnect continuity. Extensions include side-mounted components with Z-axis conductive contacts, BGA surface-mount sockets formed in recessed pits, and flexible printed circuit variants. Multi-jurisdictional filing (US, CA, JP, KR) signals commercial ambition for a process that eliminates traditional cavity-drilling and lamination.
Nano Dimension Technologies · 2018–2022 · US, CA, JP, KRThermal Management Integration for Power-Embedded PCBs
Addresses the significant heat dissipation challenge when high-power components (IGBTs, MOSFETs, power ICs) are embedded within PCB laminate stacks. Solutions include internal metal pattern layers for lateral heat spreading, thermal via arrays connecting embedded components to external heat sinks, metal-core (IMS-type) sandwich laminates, and integration with liquid cooling cold plates via 3D-printed PCB-manifold assemblies. Both the 2009 Toshiba and 2024 Toyota filings converge on the same fundamental problem — heat generated by embedded components cannot be dissipated efficiently through conventional via structures.
Toshiba · Toyota · VEDECOM · 2009–2024Patent Filing Timeline & Jurisdiction Distribution
Visual analysis of filing activity across time and geography, derived from the PatSnap Eureka dataset spanning 2005–2026.
Key Assignee Filing Activity by Era (2006–2025)
Samsung Electro-Mechanics filed from 2006 continuously through 2025; Nano Dimension entered from 2018; Toyota and VEDECOM represent the 2020–2024 power electronics wave.
Jurisdiction Distribution of Embedded PCB Filings
CN holds the highest density of embedded component substrate filings; JP shows significant prosecution activity for Korean and US-origin inventions.
Where PCB Embedded Component Technology Is Being Deployed
Patent filings map to five distinct application domains, each with characteristic assignees and technical requirements.
| Application Domain | Key Assignee(s) | Filing Years | Jurisdiction | Technical Focus |
|---|---|---|---|---|
| AI Computing & HPC Packaging | Samsung Electro-Mechanics | 2023–2024 | US, JP | Bridge-embedded PCB for AI accelerators and HBM connectivity; EPS for power integrity |
| Automotive & Power Electronics | Toyota Motor Engineering; VEDECOM Institute | 2020–2024 | CN, JP | 3D-printed PCB-cold plate assembly for EV traction inverters; IMS-type lamination for power modules |
| Consumer Electronics & Portable Devices | Toshiba Corporation; AT&S | 2009–2015 | CN, JP | Embedded components for portable computers, mobile terminals; rigid-flex PCBs with embedded optoelectronics |
| Medical & Wearable Devices | Ascensia Diabetes Care Holdings AG | 2023 | JP | Flexible PCB with embedded coin-cell battery via conductive light-curable epoxy; applicable to continuous glucose monitors |
| Server & Data Center Infrastructure | Inspur Intelligent Technology | 2023 | CN | Co-packaged working devices with chip dies for simplified signal topology and reduced routing space |
Monitor all five application domains in real time
PatSnap Eureka tracks new filings across AI packaging, automotive, medical, and server PCB embedded component technology as they publish.
Four Emerging Directions Reshaping the Embedded PCB Landscape
Based on the most recent filings in this dataset, four strategic directions are identifiable — each with distinct IP implications for R&D teams and patent strategists.
Bridge-Embedded PCBs for AI Chip Packaging
Samsung Electro-Mechanics' US (2023) and JP (2024) bridge-embedded PCB patents explicitly name AI and HBM as drivers. The embedded bridge concept enables chiplet-to-chiplet communication without expensive silicon interposers, adapting Intel's EMIB ecosystem to PCB-substrate form factors. The window for competitive IP positioning in chiplet integration for AI accelerators remains partially open.
3D-Printed Power Electronics PCB-Cold Plate Assemblies
Toyota Motor Engineering and Manufacturing North America's 2024 CN filing describes a manufacturing sequence in which a multilayer PCB is 3D-printed directly onto a power device substrate and a liquid-cooled cold plate manifold is mechanically fastened atop. This convergence of AM and thermal management for EV power modules is a nascent but highly strategic direction for automotive power electronics.
What the PCB Embedded Component Patent Landscape Means for R&D Teams
Samsung Electro-Mechanics holds the deepest IP position in conventional embedded substrate technology — passive and active embedding, bridge structures, and EPS — across the most commercially relevant jurisdictions (CN, KR, JP, US). Any entrant developing embedded component PCBs for AI compute or advanced consumer electronics packaging must conduct freedom-to-operate analysis against this portfolio, particularly the 2021–2025 CN and 2023–2024 JP/US filings. PatSnap's IP analytics platform provides the landscape mapping tools needed for this analysis.
The bridge-embedded PCB segment is nascent and fast-moving. With only a small number of assignees active in this dataset, the window for competitive IP positioning — particularly in chiplet integration for AI accelerators — remains partially open. R&D teams targeting this application should prioritize filing before the Samsung Electro-Mechanics portfolio broadens further. EPO's patent filing resources provide guidance on international prosecution strategy.
Nano Dimension Technologies represents a manufacturing disruption vector. Additive manufacturing of chip-embedded PCBs eliminates traditional cavity-drilling and lamination processes. While currently limited to prototyping and specialized production, multi-jurisdictional filing signals commercial ambition. Product developers should monitor AM process maturity and consider strategic licensing or partnering before the technology reaches production-volume cost parity. For life sciences applications of embedded PCBs, see PatSnap's life sciences intelligence solutions.
Thermal management is a persistent unresolved constraint. Both the 2009 Toshiba and 2024 Toyota filings converge on the same fundamental problem — heat generated by embedded components cannot be dissipated efficiently through conventional via structures. The integration of liquid cooling manifolds, metal-core laminates, and phase-change materials into embedded PCB structures is an underpopulated IP space with high strategic value for automotive, server, and power electronics applications. PatSnap's materials intelligence covers thermal management substrate innovations. WIPO's patent database tracks global prosecution status across all jurisdictions.
CN jurisdiction is the dominant prosecution battleground. The majority of recent embedded component substrate filings in this dataset targeting commercialization in Asia are filed or prosecuted in CN, reflecting both the concentration of PCB manufacturing capacity and market access requirements. R&D teams must maintain active CN prosecution strategies and monitor Chinese assignees (Inspur Intelligent Technology, domestic research institutes) entering the space with adapted architectures.
Key Assignees by Filing Volume & Strategic Position
Innovation in this dataset is moderately concentrated: Samsung Electro-Mechanics dominates conventional embedded substrate IP, while Nano Dimension Technologies holds distinctive AM-based positions.
Assignee Filing Volume in PCB Embedded Component Dataset
Samsung Electro-Mechanics leads with 8+ identified filings; Nano Dimension Technologies holds 5 AM-focused filings across 4 jurisdictions.
Core Manufacturing Process: Cavity-Based Chip Embedding
The foundational process flow for passive and active component embedding in multilayer PCBs, from cavity formation through via interconnection.
PCB Embedded Component Technology — key questions answered
PCB embedded component technology refers to the integration of active and passive electronic components within the laminate layers of a printed circuit board rather than mounted on its surface. This enables thinner form factors, shorter interconnect paths, improved power integrity, and higher packaging density.
Samsung Electro-Mechanics Co., Ltd. is the most prolific assignee in true embedded component PCB technology, with at least 8 distinct filings identified across CN, KR, JP, and US jurisdictions spanning 2006–2025. Nano Dimension Technologies holds the most distinctive position in additive manufacturing of chip-embedded PCBs, with filings in US, CA, JP, and KR.
The dataset identifies four main clusters: (1) passive and active component embedding in multilayer PCB — the most established cluster with filings spanning 2006–2025; (2) bridge-embedded PCB for high-density interconnect targeting AI accelerators and HBM memory; (3) additive manufacturing of chip-embedded PCBs pioneered by Nano Dimension Technologies; and (4) thermal management integration for power-embedded PCBs.
Samsung Electro-Mechanics' US (2023) and JP (2024) bridge-embedded PCB patents explicitly name AI and HBM as drivers. The embedded bridge concept enables chiplet-to-chiplet communication without expensive silicon interposers. EPS structures embed die-side and land-side capacitors to improve decoupling capacitance and reduce equivalent series inductance (ESL), directly addressing power integrity at high clock frequencies for AI processors.
Nano Dimension Technologies has filed across multiple jurisdictions for inkjet-based AM methods that print conductive and dielectric inks to form PCB structures with dedicated chip cavities. The process uses robotic arms for chip placement and encapsulating overprints for interconnect continuity. Extensions include side-mounted components with Z-axis conductive contacts, BGA surface-mount sockets formed in recessed pits, and flexible printed circuit variants. Additive manufacturing eliminates traditional cavity-drilling and lamination processes.
Four emerging directions are identifiable: (1) bridge-embedded PCBs for AI chip packaging; (2) 3D-printed power electronics PCB-cold plate assemblies for EV power modules; (3) embedded passive substrates (EPS) for power integrity in AI processors; and (4) signal-integrity-optimized embedded packaging boards for server infrastructure.
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References
- Embedded Chip Printed Circuit Board and Manufacturing Method — Samsung Electro-Mechanics Co., Ltd., 2006, CN
- Printed Circuit Board with Embedded Electronic Components and Manufacturing Method — Samsung Electro-Mechanics Co., Ltd., 2011, CN
- Printed Circuit Board with Embedded Electronic Components and Manufacturing Method — Samsung Electro-Mechanics Co., Ltd., 2007, CN
- Substrate with Embedded Electronic Components and Electronic Package — Samsung Electro-Mechanics Co., Ltd., 2021, CN
- Substrate with Embedded Electronic Components — Samsung Electro-Mechanics Co., Ltd., 2021, CN
- Substrate with Embedded Electronic Components — Samsung Electro-Mechanics Co., Ltd., 2021, CN
- Substrate with Embedded Electronic Components — Samsung Electro-Mechanics Co., Ltd., 2025, CN
- Substrate with Embedded Electronic Components and Electronic Package — Samsung Electro-Mechanics Co., Ltd., 2025, CN
- Printed Circuit Board with Embedded Bridge — Samsung Electro-Mechanics Co., Ltd., 2023, US
- Printed Circuit Board (EPS Structure, Bridge) — Samsung Electro-Mechanics Co., Ltd., 2024, JP
- Printed Circuit Board with Cavity-Embedded Bridge and Bonding Layer — Samsung Electro-Mechanics Co., Ltd., 2024, JP
- Printed Circuit Board (Signal Path via Bridge) — Samsung Electro-Mechanics Co., Ltd., 2024, JP
- Component-Embedded Printed Circuit Board, Manufacturing Method, and Electronic Device — Toshiba Corporation, 2009, CN
- Component-Embedded Printed Circuit Board, Manufacturing Method, and Electronic Device (Thermal Via) — Toshiba Corporation, 2009, CN
- Chip Embedded Printed Circuit Boards and Methods of Fabrication — Nano Dimension Technologies, Ltd., 2019, US
- Chip Embedded Printed Circuit Boards and Methods of Fabrication — Nano Dimension Technologies, Ltd., 2018, CA
- Additively Manufactured Electronic (AME) Circuits with Side-Mounted Components — Nano Dimension Technologies, Ltd., 2022, JP
- Systems and Methods for Additive Manufacturing of SMT-Mounted Sockets — Nano Dimension Technologies, Ltd., 2022, JP
- Additively Manufactured Electronic (AME) Circuits with Side-Mounted Components — Nano Dimension Technologies, Ltd., 2021, KR
- Method for Integrating Power Chips and Power Electronics Module — VEDECOM Institute, 2020, JP
- Highly Integrated Power Electronics and Manufacturing Method — Toyota Motor Engineering and Manufacturing North America, 2024, CN
- Embedded Packaging Board, PCB Packaging Structure and Manufacturing Method — Inspur Intelligent Technology Co., Ltd., 2023, CN
- Printed Circuit Board Element and Manufacturing Method — AT&S Austria Technologie & Systemtechnik AG, 2010, JP
- Method for Manufacturing a PCB Comprising at Least Two PCB Regions — AT&S Austria Technologie & Systemtechnik AG, 2015, JP
- Flexible Printed Circuit Board with Attached Battery — Ascensia Diabetes Care Holdings AG, 2023, JP
- IEEE — Institute of Electrical and Electronics Engineers: PCB and packaging standards
- European Patent Office (EPO) — International patent prosecution resources
- WIPO — World Intellectual Property Organization: Global patent database and PCT filings
All data and statistics on this page are sourced from the references above and from PatSnap's proprietary innovation intelligence platform. This landscape is derived from a targeted set of patent and literature records retrieved via PatSnap Eureka and represents a snapshot of innovation signals within this dataset only.
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